Inline Laser PCB Depaneling Machine Connecting Conveyor for SMT
With the advent of new and high power plus lower cost UV lasers
there is greater adoption of cutting of materials like printed
circuit boards. This boards may be produced from fiber glass
materials like FR4 or for thin flexible circuits they may be
fabricated from polyimide or kapton. This process can now be
handled easier and at higher throughput with lasers. Previous
issues like jutting metal tracks can be minimized and there is
minimal charring or heat affected zone. This provides a new method
to the industry and is especially useful for low volume, high mix
production and also for prototyping or engineering production as
there is no need to invest in making mechanical die sets. As the
laser is far more stable and durable then mechanical punch or
cutter it is easier to ensure long term good product cut quality.
And the laser can be programmed easily to cut infinite patterns so
there is no mechanical die making cost and lead time is almost
With thicker materials like FR4 high power UV laser can cut thicker
boards with minimal charring and HAZ. As laser cutting does not
induce mechanical stress or disturbance compare to mechanical
cutting, drilling, routing and other contact type methods, path can
be cut nearer to active areas besides reducing board thickness thus
shrinking PCBs. Other advantages are no constrain on board complex
shapes, less likely manufacturing defects, easier fixturing and
lending the process to automation.
With our laser integration expertise and material handling
experience we can design the tool customised to fit your exact
need. Please contact us today to discuss your requirement.
Capable of cutting different shapes and easily setup with our
powerful software. Free of thermal and mechanical stress depaneling
process, the Hylax PCB laser depaneling system is design to cater
for the latest trends in the PCBA industries. No more die set
fixtures conversion and router bits changes.
It is a cost effective, yet fully featured and highly reliable
equipment for the laser PCB cutting and depaneling industry.
Besides PCB it can also singulate or cut flex circuits of materials
like polyimide. It is able to cut PCB of thickness up to 1 mm well
with no charring. The machine can mark the PCBs at the same time.
This is made possible by the powerful, flexible and user friendly
software developed in-house.
- Pre-camera vision product position registration and model check
- Optowave UV laser head
- High capacity dust collector
- User friendly Window based software
- PCB flexible product jig adjustable for different board size
- High resolution and accurate Z stage with auto-focus function
- Large area low friction front loading platform for sliding multiple
- Fully covered class 1 safety enclosure
- Able to do cutting and marking together
- Compact size
|Laser||Q-Switched diode-pumped all solid-state UV laser|
|Positioning Precision of Worktable of Linear Motor||±2μm|
|Repetition Precision of Worktable of Linear Motor||±1μm|
|Effective Working Field||400mmX300mm(Customizable)|
|Laser Scanning Speed||2500mm/s (max)|
|Galvanometer Working Field Per One Process||40mmх40mm|